Aluminum Solder Paste Water-Soluble Sn96.5/Ag3.5 T3 (10g syringe)
Aluminum Solder Paste Water-Soluble Sn96.5/Ag3.5 T3 (10g syringe)
Description Chip Quik Aluminum Soldering Paste Water-Soluble Lead-Free in 5cc syringe 10g w/plunger & tip. Use to solder Aluminum Heat Sinks to printed circuit boards. For soldering Aluminum to Aluminum, Copper, and Nickel Coated Aluminum. Alloy: Sn96.5/Ag3.5 Flux Type: Water-Soluble Flux Classification: ROM1 (Water Soluble, Must be cleaned off post-use using Water or IPA) Metal Content: 75% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 221C (430F) Size: 5cc/10g syringe Shelf Life Refrigerated >18 months, unrefrigerated >12 months Stencil Life >12 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Product Features
- Lead-Free / RoHS Compliant
Buy with confidence as this product comes with 18 months full local warranty in Australia & New Zealand (unless otherwise stated in the overview).
This product also comes with the benefits of the CocoonPower Warranty. For further details please read our Warranty Guidelines.
You can also purchase 3 Year Extended Care. If you are interested please see our Extended Care Information.